Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.
There are two popular configurations for PoP assemblies:
- Pure Memory Stacking: multiple memory packages are stacked on each other
- Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package
The packages are stacked on each other and attach to each other during reflow soldering.
There are several advantages PoP assembly has over tradition packaging methods:
- Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
- Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
- Memory packages stacked in this fashion can be tested separately from the CPU package.
- As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.
Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.
Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.
To find out more, call us at 310-715-1898
Companies developing electronics—from IoT devices to medical equipment—often depend on rapid prototyping to accelerate development cycles. Working with an experienced partner like
Modern electronics manufacturing services (EMS) providers combine several technologies to assemble prototype circuit boards:
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Instead of using pins like traditional packages, a BGA uses an array of solder balls on the underside of the component. These balls create electrical connections during reflow soldering, improving both thermal conductivity and electrical performance. The result is a more robust, space-efficient, and reliable PCB assembly.
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