Tag Archives: board assembly

pcb-fabrication-and-assembly-in-usa

Understanding Quick Turn PCB Fabrication

Quick turn is imperative when it comes to PCB fabrication. Quick go-to-market can be a large source of having a competitive advantage. At ACME PCB Assembly we tend to place a great deal of importance when it comes to providing a prompt delivery service of your order, while complying with all quality control and certification measures. ACME PCB Assembly provides many different types of quick turn flex PCB fab, quick turn multi-layer PCB fab, quick turn rigid PCB fab, quick turn rigid-flex PCB fab and much more.

We incorporate strict testing protocols and our outstanding inspection systems insure that the quality is authenticated, while we still meet your timeline. Regardless if your requirement is simple or multi-layered boards, we ensure that the Quick Turn PCB Manufacturing process is seamless.

Understanding the Benefits of Quick Turn PCB Fabrication

One of the biggest benefits is the quick turnaround time, meaning that you can get your product to market without any manufacturing delay.  This in turn gives you a leading advantage from the other competition, especially since you are likely to be operating in a highly competitive market.  ACME PCB Assembly ensures that your go to market plans are not ruined or delayed by the non-availability of PCB boards.  We offer high quality boards in a timely manner, which helps getting through the initial product launch and marketing plan seamlessly.

Applications Available for Quick Turn PCB Fabrication

Turnkey PCBPCB Prototypes

Quick turn PCBs hold their importance in prototyping because when you need a quick and accurate idea of how your final product will look and perform, they are done quickly and available right away. Quick turnaround times come in handy, in determining the efficacy of the product before investing in a large production run. It’s also an advantage in the fact that any improvements or changes can be made in a timely matter holds it’s perks also.

Standard Production Run

When you are ready and start looking for larger production runs, the one thing that is of most importance is the delivery time.  Quick turn PCBs ensure that there are no delays, making it possible for device manufacturers to reach their end consumer quickly.  Another factor to look at is that shorter manufacturing times with standard SOPs can also result in optimization of costs, which is a significant source of competitive advantage.

Package on Package ( PoP ) Component and Assembly

Package on Package (PoP) will be a PCB assembly trend in the near future. Just like Year 1995 when BGA components just starting on the market. The Package on Package (PoP) is an integrated circuit packaging method to combine vertically 2 or more memory ball grid array (BGA) package.

Package on Package ( PoP )

Package on Package ( PoP )

ACME PCB Assembly is start running the Package on Package (PoP) since year 2009. Now is more and more requirement for this type assembly. This PoP device helps reduce external pin count through package level system design; it does help PCB layout engineer and make their job a lot easier. Total package high dependent on PoP configuration, but the min. 1.4mm possible.

The Package on Package (PoP) assembly yield rate is high; it is not that difficult as people thought. Now, many products already design their memory as pure memory stacking.  The use of leading edge PCBA manufacturing tool, such as our FUJI assembly line allow our customers to easily access this technology.  ACME PCB Assembly provide manufacturing services for package on package (PoP) BGA assembly for medium batch production and rapid prototype run. The quantity from 1 piece to 20,000 pieces.

Contact Board Assembly for more information.

Tel: 310-715-1898