You might be wondering what solder mask is and why it’s important.  Solder masks are a very important part of protecting a PCB.  Solder mask, or solder resister is a thin covering that protects the PCB from oxidation.  It also prevents solder bridges from forming between solder pads that are close together. One example of other ways that solder masks can be used effectively by companies are how solder masks are traditionally green but are

Cable Harnesses (Wire harness, cable assembly, wiring assembly) is an assembly of electrical cables or wires which transmit signals or electrical power. Cable harnesses are different from wire harnesses and it is important to understand the difference. A wire is a single conductor, while cables are two or more wires that are insulated being wrapped in a larger jacket. These two technologies demand their own set of unique tools, fixtures, and machinery to help reduce

There Are Differences Between Printed Circuit Board Manufacturing and Printed Circuit Board Assembly, But You Might Be Asking What Are They? In the world of electronics, the terms Printed Circuit Board (PCB) Manufacturing and PCB Assembly are often used interchangeably—but they actually refer to two distinct processes. Understanding the difference is essential when choosing the right partner for your electronic product development. At Yun Industrial / ACME PCB Assembly, we specialize in both PCB manufacturing

At Yun Industrial Co., Ltd. dba: ACME PCB Assembly, we are fully committed to ethical sourcing and responsible business practices throughout our entire supply chain. We proudly declare that all metals used in our production processes are Conflict-Free, ensuring that none of our materials contribute to human rights violations or illegal trade activities. Our Commitment to Responsible Sourcing ACME PCB Assembly takes a proactive approach to ensure that metals such as Gold (Au), Tungsten (W),

In the ever-evolving landscape of electronics manufacturing, Package on Package (PoP) technology is transforming how circuit boards are designed and assembled. First gaining traction in the early 2000s, PoP is now considered one of the most innovative advances since the introduction of Ball Grid Array (BGA) components in the mid-1990s. At its core, PoP is an integrated circuit packaging method that vertically stacks two or more BGA packages—typically combining a logic processor and memory component.