Tag Archives: Electronic Manufacturing Service provider

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Modifying and Reworking Electronic Printed Circuit Boards in USA

There is constantly a need for all circuit board repair and rework.  ACME PCB Assembly provides common rework and modification services for your existing printed circuit boards.  We will custom fit our service to our clients needs by using a wide variety of leading-edge technology.  We have highly skilled staff that will complete your project on time or as a 1-day assembly.

ACME PCB Assembly provides refinishing and repairs of all types of electronic printed circuit boards, which usually involves de-soldering and re-soldering of the surface mounted electronic components.  Manual techniques by expert personnel using appropriate equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate tools.

A hot air gun or hot air station is used to heat devices and melt solder, and specialized tools are used to pick up and position often tiny components.  Before you consign circuit boards to the scrap barrel, call ACME PCB Assembly , because today no company can afford to throw money away.

310.715.1898

ACME Go Green for the Environment

ACME PCB Assembly working as a Greenhouse for Electronic Manufacturing Service. the solar panel save 64.2KW which Environmental benefits, over 30 years, the PV system is estimated to offset: CO2 emissions (greenhouse gas) 4136092 lbs. Particulates that cause asthma 817 lbs. it’s equivalent to taking 21.8 cars off the road for 25 years, or Planting 35.5 acres of trees. 
sounds great? Applause for ACME PCB Assembly, right? 

Many reasons drive the global push to “go green”. While nature conservation is one of them, ensuring economic and social wellbeing, mental and physical health, and a sustainable future for humans are some other powerful incentives.

This reliance on natural resources for material and energy requirement is becoming a major environmental and economic problem says EcoWatch, depleting resources needed to “power economies and lift people out of poverty.” Since many of the resources are non-renewable, at current rates of use, the world will run out of many necessary materials. Even renewable resources are at risk as some need long periods to be replenished point out by the experts.

Contact us for more information how we go green in our processes.  

 

Processor with ball BGA pins

Ball Grid Array (BGA) Assembly Inspections

ACME PCB Assembly has provided (Ball Grid Array) BGA assembly, BGA rework, and BGA reballing service for Printed Circuit Boards since 1994. Having 20+ years experience behind us, we have extensive knowledge on how to assemble high quality (Ball Grid Array) BGAs. We have experience with everything from Micro BGAs to large size BGAs (55 mm), and ceramic BGAs to plastic BGAs.

BGA-boardsBGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows for the customer to have more room for the PCB layout.  Ball Grid Array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting.

ACME PCB Assembly has a quality system for BGA assembly, the BGA will be received and inspected, and kept in a 40-degree Celsius storage with a 1% humility baking oven to make sure the BGA is good condition before assembly.  We inspect the BGA with a 3D X-ray, and make sure the void is under 25% of the total solder ball diameter. By using the X-Ray inspection process, we can eliminate the soldering problem on the board, such as solder bridging and insufficient ball melting.

We also add an additional layer inspection after the X-Ray inspection is done; using the ERSA scope to inspect the solder ball on the underside of the BGA so that we are sure the profile is correct; we assure you excellent quality during the BGA assembly process.  Some BGA assembly boards have VIA connect to the BGA pad, the best condition for that is have a VIA epoxy plug, and have the solder mask on the trace, so that solder is not wicked to the VIA and cause the solder to function insufficiently during the BGA assembly process.

By having ACME PCB Assembly do the BGA assembly prototype with or without Stencil will save you as the customer on assembly costs.

Please call us at 310-715-1898 for get more information or Assembly quotation.