The design rules for flex turnkey PCB assembly is very similar to the design rules for traditional PCBs.  Traditional PCBs and flex flex turnkey PCB assembly share some similarities in the manufacturing process as well.  To start, the flexible circuit board material (typically copper clad Polyimide) is chosen, drilled, plated, photo-imaged, and imprinted just like the conservative PCB process. Next, both PCBs and flex turnkey PCB assemblies involve the panels being baked to remove any

In today’s fast-paced technology landscape, using high-quality PCBs in your projects is essential for success. Printed circuit boards form the backbone of countless devices, from smartphones to industrial machines, and their performance can make or break your innovation. Ensuring that the printed circuit boards you select meet rigorous standards and are produced under stringent quality control measures is key to delivering reliable, durable, and efficient products. When working on any tech-driven project, it’s crucial to

  When it comes to printed circuit board (PCB) manufacturing, the terms “full turnkey” and “turn-key assembly” are often synonymous with efficiency, quality, and convenience. At Board Assembly, we offer comprehensive solutions that cater to every aspect of PCB production. Our full turnkey services are designed to streamline the entire process, from initial design and prototyping to final production and testing, ensuring that every product meets the highest standards of quality and reliability. What is

In the fast-paced world of electronics manufacturing, efficiency and precision are paramount. At Board Assembly, we understand the critical role that a seamless production process plays in bringing innovative products to market swiftly and reliably. That’s why we offer comprehensive full turnkey solutions designed to meet the diverse needs of our clients. These solutions not only streamline the production process but also ensure that every detail is meticulously handled, from initial design to final delivery.

BGA rework, replacement. Board Assembly uses the most powerful tools to maintain the state-of-the-art production.  Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons.  Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues.  These irregularities can be resolved with BGA rework. We provide a comprehensive BGA rework and re-balling services