Is Through-Hole Assembly Still Important to Use? Before the 1960s, the through-hole assembly process for mounting components onto printed circuit boards was the only game in town. It was labor-intensive and required a lot of space, but it was the only option. That all changed with the rise of surface mount technology (SMT), which allows for components to be mounted directly onto a printed circuit board’s surface. Since SMT doesn’t require drilling holes through a

ACME PCB Assembly has provided (Ball Grid Array) BGA assembly, BGA rework, and BGA reballing service for Printed Circuit Boards since 1994. Having 20+ years experience behind us, we have extensive knowledge on how to assemble high quality (Ball Grid Array) BGAs. We have experience with everything from Micro BGAs to large size BGAs (55 mm), and ceramic BGAs to plastic BGAs. BGA assembly is a type of SMT process, which is used for Printed

Acme PCB Assembly hereby declares that the metal used in our production line is Conflict-Free Acme PCB Assembly had investigated and will continue to monitor our supply chain to ensure that metal such as gold(Au), Tungsten(W), Tantalum(Ta), cobalt(Co), and Tin(Sn) are not derived or sourced from mines in conflict areas of the Democratic Republic of Congo, or exported through illegal means or trade routes that are controlled by non-governmental military group, unlawful military factions. As

Package on Package (PoP) will be a PCB assembly trend in the near future. Just like Year 1995 when BGA components just starting on the market. The Package on Package (PoP) is an integrated circuit packaging method to combine vertically 2 or more memory ball grid array (BGA) package. Package on Package ( PoP ) ACME PCB Assembly is start running the Package on Package (PoP) since year 2009. Now is more and more requirement