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Turnkey Yun Industrial

Differences Between Full Turn Key and Partial Turn Key Printed Circuit Board Services

Differences Between Full Turn Key and Partial Turn Key Printed Circuit Board Services

You are looking for a printed circuit board turn-key assembly provider for a new product. When you call up a printed circuit board manufacturer, the first question you are likely to get is, “Do you want full turn key service or partial turn key service?” What is the difference between full and partial turn key service, and what is the best option for you?

Partial Turn Key Service

To make a printed circuit board, the manufacturer needs a variety of components. First, they need the circuit board itself. Next, they’ll need electronic components, conductive tracks, and pads. They may also need capacitors, resistors, and other components that will be soldered onto the printed circuit board.

If you choose partial turn key service, you will be expected to supply your printed circuit board turn-key assembly with the circuit boards along with some of the parts. Your vendor can then get the rest of the parts and proceed with the fabrication of the fully printed circuit board.

The partial turn key option is ideal if you already have a lot of parts on hand and want to save time and money. If you don’t have parts, don’t know where to order the right parts, or don’t even know what the right parts are for your printed circuit board, then the full turn key service is probably a better option for you.

Full Turn Key Service

Turnkey PCBThe full turn key service is just like what it sounds. The printed circuit board turn-key assembly provider does all the work. They provide the circuit boards, order all the parts, and fabricate the circuit order. Basically, all you need to do is put in the order. The PCB assembly provider might even be able to help you develop the necessary plans and parts list to get your project off the ground. While a full turn key service will be more expensive than partial turn key service, it can save you a lot of hassle and headaches, especially if you are new to the world of printed circuit boards.

At ACME PCB Assembly, we offer both partial turn key service and full turn key service. We are happy to work with clients from step one of their project or to jump in to complete the project if necessary. If you aren’t sure which service is right for you, contact us today and we would be glad to tell you more about both options.

Our turn-key assembly project for electronics manufacturing services (EMS) model encompasses a broad range of electronics manufacturing services, from design to prototype to production to order fulfillment. We also perform Turn-Key box build, mechanical and final assembly, and packaging.

 

Restriction of Hazardous Substances (RoHS) Directive

Perhaps the greatest reliability issue to come out of the Restriction of Hazardous Substances (RoHS) Directive is tin whiskers. This residual effect of RoHS is nothing new to electronics manufacturing. Tin whiskers were first been reported in the 1940s and credited with taking down satellites and military planes, causing critical failures to pacemakers and space shuttle systems and even the shutdown of a nuclear power facility.

Tin whiskers cause their fair share of headaches, but they can’t be solved by keeping them out of water and not feeding them after dark. Tin whiskers, their causes and how to prevent them, typically bring more questions than answers. These are the answers Dr. Werner Hügel, Robert Bosch GmbH, has been seeking for years and will discuss during his presentation, “Whisker Prevention and the Relevance of Plating Conditions” during the CALCE Annual Tin Whiskers Symposium at IPC TechSummit, October 28-30, 2014 in Raleigh, N.C.

Dr. Hügel is responsible for the backend technology, galvanic surface finishes and solderability requirements for the automotive electronics division at Robert Bosch. The electronic packages his group is responsible for are found in such areas as: airbag, engine management and transmission control systems, all of which ensure driver and passenger safety. High reliability and low failure rates—especially those caused by tin whiskers—are essential. An electronic short to one of these systems could result in potential harm to people or costly recalls.
Hügel will discuss: four basic whisker growth mechanisms, the relevance of the properties of the tin-finish on whisker formation and whisker mitigation. He will also share insights and data on the influence of plating conditions and plating parameters on whisker performance. Attendees will also learn an approach for effective whisker prevention supported by a modified testing procedure.

The following is a preview of the data, findings and recommendations Hügel will share.

Why whiskers grow

Why tin whiskers grow is a question that has boggled minds for decades. Hügel, however, does have his own theories—on tin whisker formation. According to him, whiskers will grow if there is an overall compressive stress (close to the yield limit of tin) in combination with a stress gradient (- 50 MPa/µm) toward the surface. This situation can be achieved by four basic mechanisms:

•       Growth of irregular intermetallic compounds (IMC) between Cu and Sn
•       Mismatch of coefficient of thermal expansion (CTE) between the base material and tin plating (e.g., delta CTE > 8 ppm)
•       External mechanical force on the tin layer over a long period of time (in press-fit, clamping) not bending
•       Corrosion-induced whisker growth (humid environment)
Why tin finish properties are important
Whisker growth can compromise the functionality of applications; therefore, the risk due to whisker growth has to be minimized, so it’s understandable why tin finish properties themselves are so important. Hügel indicates that tin finish properties are highly relevant to tin whisker growth in terms of:
•       Tin plating process (preparation)
•       Process parameters (process window) (temperature, concentration, agitation, current density, etc.)
•       Electrolyte (type)
•       Maintenance (process conditions such as agitation and current density)
•       Texture of the plating and the robustness of the texture against variations of current density, agitation, etc. The texture itself is the relevant factor regarding whisker growth of the tin plating (impact on CTE, chemical potential, etc.)
Minimizing risk
To minimize the risk of whisker growth, the root cause of whisker growth has to be identified and countermeasures have to be implemented.
According Hügel, “Conformal coating is not seen as the mitigation strategy because of the different side effects and the effectiveness of the coating in case of whisker growth. Third-generation electrolytes can provide excellent performance if the process is well defined and maintained.”
This only scratches the surface of the many parameters that go into whisker formation and prevention. Hügel will delve even deeper into these topics and others.
He will explain why maintenance is a major critical point for tin plating and the necessity for tin plating layer systems to fulfill minimum requirements (thickness, plating system setup, type of plating). He will also share how, by arming yourself with the knowledge of the robustness of the plating, a no-whisker, tin plating can be achieved.
For more information on the CALCE Annual Tin Whiskers Symposium at IPC TechSummit 2014, and to register, go to www.ipc.org/TechSummit.

Bare Board

Electronics Printed Circuit Board (PCB) Fabrication

Electronics Printed Circuit Board (PCB) Fabrication

In this Technological era, more and more, fast and faster, new products are being developed to help humanity have better envelopment and better life.  All development of electronics stuff needs to use Printed Circuit Board (PCB) fabrication services to make their products.  Selecting the right Printed Circuit Board (PCB) fabrication house can make for a difficult challenge, it all depends on what type of product you are planning on working with.  If you are one of those companies that have more than a few products that have different requirements ACME PCB Assembly can assist you with all your needs.

ACME PCB Assembly will help you select the perfectly matched Printed Circuit Board (PCB) fabrication house for each of your new jobs.  We currently are working with over 10 Printed Circuit Board (PCB) fabrication houses, so we can closely match all new incoming inquires to an Electronics Printed Circuit Board (PCB) fabrication house.

Each Printed Circuit Board (PCB) fabrication house has strengths in different areas.  All offer great economic cost, flexibility of service, quick turn-around lead time.  There are a variety of factors to help you choose a great Printed Circuit Board (PCB) fabrication shop for each different project needs, but it is one of ACME PCB Assembly’s specialty.

New customer special discount on 2 & 4 layers printed circuit board fabrication. Trust our high-quality standard is the main reason we always have return customer. ACME Printed Circuit Board Assembly has over 25% customers are over 10 years relationship.  Over 25 years in the printed circuit board assembly service business, ACME Printed Circuit Board Assembly knows how to make customer satisfied.

Printed Circuit Board FabricationACME PCB Assembly is in Carson, California and provides the following services and more.

ACME PCB Assembly is an ISO 9001:2008 certified EMS provider, we make sure that you get the best price without compromising the quality. We take full responsibility for your printed circuit board order since we only use ACME PCB Assembly certified suppliers as our domestic and offshore partner.

Contact us today to find out about our other services and how we can help your business.

 

 

 

 

 

 

PCB Fabrication near me

Finding Electronic Turn-Key Assembly Manufacturing Services in the USA

Most entrepreneurs and manufacturers sometimes think the old ways of manufacturing electronics and printed circuit board manufacturing can be very intimidating because it is a slow process that can be prone to errors, and also expensive, which makes people hesitant to use it. Electronic turn-key assembly manufacturing wasn’t designed for small batch runs and prototypes, but to help support enormous orders with a long lead time. Luckily, the services of Turnkey Printed Circuit Board ( PCB) assembly are coming in today to meet the needs of hardware designers.

What is Turnkey Printed Circuit Board Assembly?

It is a new method to an electronic assembly that is influenced by onshore PCB manufacturing and cloud-based software to generate emerging printed circuit boards stress-free and fast for entrepreneurs, manufacturers, engineers, and small enterprises. 

Turnkey PCB assembly is taken beyond just printed circuit boards by some services and offers the service that is essential to come out with your completed products. Your product will be assembled as needed and the record of your part will be retained.

pcb-fabrication-and-assembly-in-california

People who can use Turnkey PCB Assembly

Anyone with a design can quickly at an affordable price bring out their new ideas because this new method of printed circuit board manufacturing eliminates all the limitations of quantity and cost in the legacy system. For all the startups and small enterprises that want to bring their products to market without risk and cost of big inventories, Turnkey PCB assembly is just the ideal approach to use. Also, it can be beneficial for kick-starter manufacturers who might not know whether they’ll require just hundreds or few boards. The flexibility and speed of instant PCB construction are also enjoyed by producers and hobbyists. Engineers in large enterprises also see it to be faster, easier and, more fascinating than traditional approaches.

At ACME PCB Assembly, we set high standards for the efficiency, quality and speed of our performance. Our turn-key supplies chain management solution, worldwide network of resources.

BGA-boards

The Benefits of Package-on-Package Assembly

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.

BGA-boardsThere are two popular configurations for PoP assemblies:

  • Pure Memory Stacking: multiple memory packages are stacked on each other
  • Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package

The packages are stacked on each other and attach to each other during reflow soldering.

There are several advantages PoP assembly has over tradition packaging methods:

  • Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
  • Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
  • Memory packages stacked in this fashion can be tested separately from the CPU package.
  • As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.

Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.

Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.

To find out more, call us at 310-715-1898