Package on Package (PoP) will be a PCB assembly trend in the near future. Just like Year 1995 when BGA components just starting on the market. The Package on Package (PoP) is an integrated circuit packaging method to combine vertically 2 or more memory ball grid array (BGA) package.

Package on Package ( PoP )

ACME PCB Assembly is start running the Package on Package (PoP) since year 2009. Now is more and more requirement for this type assembly. This PoP device helps reduce external pin count through package level system design; it does help PCB layout engineer and make their job a lot easier. Total package high dependent on PoP configuration, but the min. 1.4mm possible.

The Package on Package (PoP) assembly yield rate is high; it is not that difficult as people thought. Now, many products already design their memory as pure memory stacking.  The use of leading edge PCBA manufacturing tool, such as our FUJI assembly line allow our customers to easily access this technology.  ACME PCB Assembly provide manufacturing services for package on package (PoP) BGA assembly for medium batch production and rapid prototype run. The quantity from 1 piece to 20,000 pieces.

Contact Board Assembly for more information.

Tel: 310-715-1898