Tag Archives: package-on-package

2 BGAs or More vertical installing.

The Rise of Package on Package (PoP) in PCB Assembly

In the ever-evolving landscape of electronics manufacturing, Package on Package (PoP) technology is transforming how circuit boards are designed and assembled. First gaining traction in the early 2000s, PoP is now considered one of the most innovative advances since the introduction of Ball Grid Array (BGA) components in the mid-1990s.

At its core, PoP is an integrated circuit packaging method that vertically stacks two or more BGA packages—typically combining a logic processor and memory component. This space-saving configuration allows for compact, high-performance assemblies ideal for smartphones, wearables, medical devices, and advanced industrial electronics.

The Advantages of PoP Technology

The primary benefit of PoP technology lies in its ability to reduce external pin count through package-level system integration. By stacking chips vertically, engineers can achieve a smaller footprint without sacrificing power or performance. This simplification not only optimizes PCB layout efficiency but also improves overall product reliability by minimizing interconnect lengths and signal interference.

Depending on the configuration, PoP packages can reach a total height as low as 1.4mm, making them perfect for compact devices where every millimeter counts. Additionally, PoP assemblies support independent testing of logic and memory layers, resulting in higher manufacturing yields and easier defect isolation during production.

ACME PCB Assembly: Leading the Way Since 2009

Since 2009, ACME PCB Assembly has been a leader in adopting and refining PoP technology. Utilizing advanced FUJI assembly lines and precise reflow soldering techniques, ACME delivers reliable PoP BGA assemblies for both prototype runs and medium-batch production.

From single-unit builds to production runs of up to 20,000 pieces, ACME’s skilled technicians ensure precise alignment, solder integrity, and quality control at every stage. This allows clients to seamlessly integrate high-density packaging into their next-generation designs—accelerating time to market while maintaining exceptional performance standards.

Whether you’re developing consumer electronics, industrial control systems, or medical devices, PoP technology offers a compact and efficient solution.

Embrace the Future of PCB Assembly

2 BGAs or More vertical installing.

ACME PCB Assembly is your trusted partner for Package on Package assembly, offering experience, precision, and scalability for your most advanced designs. Contact Board Assembly today at 310-715-1898 to learn how PoP can enhance your next project.

BGA-boards

The Benefits of Package-on-Package Assembly

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.

Package-on-Package assemblyThere are two popular configurations for PoP assemblies:

  • Pure Memory Stacking: multiple memory packages are stacked on each other
  • Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package

The packages are stacked on each other and attach to each other during reflow soldering.

There are several advantages PoP assembly has over tradition packaging methods:

  • Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
  • Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
  • Memory packages stacked in this fashion can be tested separately from the CPU package.
  • As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.

Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.

Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.

To find out more, call us at 310-715-1898