Tag Archives: package-on-package

2 BGAs or More vertical installing.

The Rise of Package on Package (PoP) in PCB Assembly

In the ever-evolving world of electronics, Package on Package (PoP) technology is emerging as a significant trend in PCB assembly, reminiscent of the introduction of BGA components in 1995. PoP is an innovative integrated circuit packaging method that vertically combines two or more memory ball grid array (BGA) packages. This approach is gaining traction due to its efficiency and design benefits.

2 BGAs or More vertical installing. ACME PCB Assembly has been at the forefront of this technology since 2009. The demand for PoP assembly has been steadily increasing, driven by its ability to reduce external pin count through package-level system design. This simplification greatly aids PCB layout engineers, making their tasks more manageable. Depending on the configuration, the total package height can be as minimal as 1.4mm, offering compact solutions for modern electronic devices.

One of the key advantages of PoP technology is its high assembly yield rate. Contrary to initial perceptions, implementing PoP is not as challenging as once thought. Many products now incorporate pure memory stacking in their designs, leveraging the benefits of this advanced packaging method. ACME PCB Assembly utilizes cutting-edge manufacturing tools, such as the FUJI assembly line, to provide customers with easy access to PoP technology.

ACME offers comprehensive manufacturing services for PoP BGA assembly, catering to medium batch production and rapid prototype runs. Whether you need a single piece or up to 20,000 units, ACME is equipped to meet your needs with precision and efficiency.

For more can benefit your projects, contact Board Assemblyinformation on how PoP technology  at 310-715-1898. Embrace the future of PCB assembly with PoP and stay ahead in the competitive electronics market.

BGA-boards

The Benefits of Package-on-Package Assembly

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.

BGA-boardsThere are two popular configurations for PoP assemblies:

  • Pure Memory Stacking: multiple memory packages are stacked on each other
  • Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package

The packages are stacked on each other and attach to each other during reflow soldering.

There are several advantages PoP assembly has over tradition packaging methods:

  • Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
  • Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
  • Memory packages stacked in this fashion can be tested separately from the CPU package.
  • As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.

Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.

Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.

To find out more, call us at 310-715-1898