Tag Archives: package-on-package

BGA-boards

The Benefits of Package-on-Package Assembly

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.

BGA-boardsThere are two popular configurations for PoP assemblies:

  • Pure Memory Stacking: multiple memory packages are stacked on each other
  • Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package

The packages are stacked on each other and attach to each other during reflow soldering.

There are several advantages PoP assembly has over tradition packaging methods:

  • Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
  • Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
  • Memory packages stacked in this fashion can be tested separately from the CPU package.
  • As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.

Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.

Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.

To find out more, call us at 310-715-1898

Package on Package ( PoP ) Component and Assembly

Package on Package (PoP) will be a PCB assembly trend in the near future. Just like Year 1995 when BGA components just starting on the market. The Package on Package (PoP) is an integrated circuit packaging method to combine vertically 2 or more memory ball grid array (BGA) package.

Package on Package ( PoP )

Package on Package ( PoP )

ACME PCB Assembly is start running the Package on Package (PoP) since year 2009. Now is more and more requirement for this type assembly. This PoP device helps reduce external pin count through package level system design; it does help PCB layout engineer and make their job a lot easier. Total package high dependent on PoP configuration, but the min. 1.4mm possible.

The Package on Package (PoP) assembly yield rate is high; it is not that difficult as people thought. Now, many products already design their memory as pure memory stacking.  The use of leading edge PCBA manufacturing tool, such as our FUJI assembly line allow our customers to easily access this technology.  ACME PCB Assembly provide manufacturing services for package on package (PoP) BGA assembly for medium batch production and rapid prototype run. The quantity from 1 piece to 20,000 pieces.

Contact Board Assembly for more information.

Tel: 310-715-1898