In the ever-evolving world of electronics, Package on Package (PoP) technology is emerging as a significant trend in PCB assembly, reminiscent of the introduction of BGA components in 1995. PoP is an innovative integrated circuit packaging method that vertically combines two or more memory ball grid array (BGA) packages. This approach is gaining traction due to its efficiency and design benefits.

ACME PCB Assembly has been at the forefront of this technology since 2009. The demand for PoP assembly has been steadily increasing, driven by its ability to reduce external pin count through package-level system design. This simplification greatly aids PCB layout engineers, making their tasks more manageable. Depending on the configuration, the total package height can be as minimal as 1.4mm, offering compact solutions for modern electronic devices.

One of the key advantages of PoP technology is its high assembly yield rate. Contrary to initial perceptions, implementing PoP is not as challenging as once thought. Many products now incorporate pure memory stacking in their designs, leveraging the benefits of this advanced packaging method. ACME PCB Assembly utilizes cutting-edge manufacturing tools, such as the FUJI assembly line, to provide customers with easy access to PoP technology.

ACME offers comprehensive manufacturing services for PoP BGA assembly, catering to medium batch production and rapid prototype runs. Whether you need a single piece or up to 20,000 units, ACME is equipped to meet your needs with precision and efficiency.

For more can benefit your projects, contact Board Assemblyinformation on how PoP technology  at 310-715-1898. Embrace the future of PCB assembly with PoP and stay ahead in the competitive electronics market.