Author Archives: Erin

Processor with ball BGA pins

Ball Grid Array (BGA) Assembly Inspections

ACME PCB Assembly has provided (Ball Grid Array) BGA assembly, BGA rework, and BGA reballing service for Printed Circuit Boards since 1994. Having 20+ years experience behind us, we have extensive knowledge on how to assemble high quality (Ball Grid Array) BGAs. We have experience with everything from Micro BGAs to large size BGAs (55 mm), and ceramic BGAs to plastic BGAs.

BGA-boardsBGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows for the customer to have more room for the PCB layout.  Ball Grid Array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting.

ACME PCB Assembly has a quality system for BGA assembly, the BGA will be received and inspected, and kept in a 40-degree Celsius storage with a 1% humility baking oven to make sure the BGA is good condition before assembly.  We inspect the BGA with a 3D X-ray, and make sure the void is under 25% of the total solder ball diameter. By using the X-Ray inspection process, we can eliminate the soldering problem on the board, such as solder bridging and insufficient ball melting.

We also add an additional layer inspection after the X-Ray inspection is done; using the ERSA scope to inspect the solder ball on the underside of the BGA so that we are sure the profile is correct; we assure you excellent quality during the BGA assembly process.  Some BGA assembly boards have VIA connect to the BGA pad, the best condition for that is have a VIA epoxy plug, and have the solder mask on the trace, so that solder is not wicked to the VIA and cause the solder to function insufficiently during the BGA assembly process.

By having ACME PCB Assembly do the BGA assembly prototype with or without Stencil will save you as the customer on assembly costs.

Please call us at 310-715-1898 for get more information or Assembly quotation.

PCB Fabrication near me

Why Turnkey PCB Assembly Is the Ideal Solution for Modern Hardware Designers

For many entrepreneurs and manufacturers, traditional methods of electronics and printed circuit board (PCB) manufacturing can seem intimidating. Legacy manufacturing is often slow, error-prone, and expensive, which makes it difficult to move from concept to finished product. Historically, electronic assembly was designed for large batch runs and long lead times, leaving smaller orders and prototypes in a bind.

Today, however, turnkey PCB assembly has revolutionized the industry, making it faster, easier, and more cost-effective for hardware designers to bring their ideas to life. Let’s explore what makes turnkey PCB assembly such a game-changer and who can benefit from this modern approach.

Turnkey Yun IndustrialWhat Is Turnkey Printed Circuit Board Assembly?

Turnkey PCB assembly is a streamlined approach to electronic assembly that combines onshore PCB manufacturing with cloud-based software solutions. This synergy simplifies the entire process of developing and producing PCBs for entrepreneurs, engineers, and small businesses.

Unlike traditional methods that require coordinating multiple suppliers for components, assembly, and testing, turnkey PCB assembly consolidates all these steps under one roof. Some services even go beyond PCBs, providing full product assembly and record management, ensuring that your product is ready for market.

Who Can Benefit from Turnkey PCB Assembly?

One of the biggest advantages of turnkey PCB assembly is its accessibility. Here’s who stands to gain the most:

  • Startups and Small Businesses
    For companies just starting out, avoiding the high costs and risks of large inventories is crucial. Turnkey PCB assembly enables them to produce small quantities affordably, making it easier to test the market without financial strain.

  • Kickstarter and Crowdfunding Projects
    If you’re launching a product through a crowdfunding campaign, you may not know exactly how many boards you’ll need. Turnkey services give you the flexibility to produce just a few boards—or scale up quickly as demand grows.

  • Hobbyists and Makers
    Individual creators and small workshops benefit from the speed and convenience of instant PCB production. Whether you’re building a prototype or refining a new gadget, turnkey assembly makes it easy.

  • Engineers at Large Enterprises
    Even established companies can appreciate the faster turnaround times and simplified process compared to legacy manufacturing methods.

The ACME PCB Assembly Advantage

At ACME PCB Assembly, we pride ourselves on our high standards for efficiency, quality, and speed. Our turnkey supply chain management solutions and global network of resources enable us to handle projects of all sizes with precision and reliability.

📞 Contact us today to learn how our turnkey PCB assembly services can bring your electronic ideas to life—faster, more cost-effectively, and with fewer headaches.

BGA-boards

The Benefits of Package-on-Package Assembly

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them.

Package-on-Package assemblyThere are two popular configurations for PoP assemblies:

  • Pure Memory Stacking: multiple memory packages are stacked on each other
  • Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package

The packages are stacked on each other and attach to each other during reflow soldering.

There are several advantages PoP assembly has over tradition packaging methods:

  • Package-on-Package assembly more efficiently uses space, as packages are stacked vertically, increasing the effective space on the motherboard. The reduced space requirements for PCB assemblies caused by package-on-package assembly allowed smartphones and other compact electronic devices to achieve higher levels of performance without increasing in size.
  • Package-on-Package assembly also shortens the track length between components, causing better electrical performance as the shorter length will reduce noise and cross talk, and promote faster signal response.
  • Memory packages stacked in this fashion can be tested separately from the CPU package.
  • As long as the memory package fits on the CPU package, any memory package can be used, increasing flexibility in design.

Package-on-Package assembly is a delicate process and you should rely on an experienced and reliable PCB assembler such as IPC A-610 certified company like ACME PCB Assembly to build your products.

Whether you need Printed Circuit Board (PCB) assembly, consignment assembly or turnkey material-procurement assembly, we have what is necessary to manage your entire project efficiently. With over 26 years of experience in Electronics Manufacturing Services (EMS) we learned that reasonable assembly cost, high-quality service, on-time delivery and good communications are the keys that keep our customers happy and is how we made our business successful.

To find out more, call us at 310-715-1898

Printed circuit board production

uBGA Assembly on Double Sided Flex Circuit Board

There are many benefits of uBGA Assembly on Double Sided Flex Circuit Board offered by the Acme PCB Assembly, beginning with the fact it can considerably improve the physical characteristics of a design by reducing both weight and size. The cost and performance advantages of using uBGA Assembly on Double Sided Flex Circuit Boards are also quality points that engineers and designers keep in mind, since this technology is used in many types of industries.

ACCURATE, EFFICIENT uBGA ASSEMBLY ON DOUBLE SIDED FLEX CIRCUIT BOARD

A correctly constructed uBGA assembly on double sided flexible circuit board is at the heart of many successful product production operations. Flexible Circuit board assembly and design is a complex, specialized process, which is why many companies choose to outsource this task to a PCB assembly provider that has the capability to get the job done properly and promptly. If you need high-grade uBGA Assembly on flexible printed circuit board that results in a high-performance solution to your manufacturing requirements, Acme PCB Assembly can help.

If you need help with Ball Grid Array (BGA/uBGA) assembly on a double sided flex circuit boards contact us today and we can give you a quote for your next project.

DOUBLE SIDED FLEX CIRCUIT BOARD PERFORMANCE VS RIGID PCB

  • Superior heat dissipation.
  • Dynamic Flexing.
  • Lower inductance (vs traditional wiring systems).
  • Superior package density.

Flexible Circuit boardPRINTED CIRCUIT BOARD ASSEMBLY COMPANY TO MEET YOUR DEADLINES

ACME PCB Assembly uses the most advanced equipment for the development and manufacturing of high performance uBGA Assembly on Double Sided Flex Circuit Board . ACME PCB Assembly has equipment and processes which allow us to offer our customers a flexible, cost-effective, and quality-focused assembly. ACME understands the challenges companies face for their projects. ACME Flexible PCB Assembly is able to accommodate large orders while getting the work done within the the time expected.

To find out more, call us at 310-715-1898

BGA inspection

Ball Grid Array (BGA) Assembly: High-Density SMT Solutions from ACME PCB

A Ball Grid Array (BGA) is a type of Surface Mount Technology (SMT) packaging widely used for integrated circuits (ICs) that require a large number of interconnects. BGA packaging allows for a compact, high-density design, enabling the integration of more functions on a single chip module—making it an essential component in today’s modern electronics.

What Makes BGA Technology So Effective?

BGAInstead of using pins like traditional packages, a BGA uses an array of solder balls on the underside of the component. These balls create electrical connections during reflow soldering, improving both thermal conductivity and electrical performance. The result is a more robust, space-efficient, and reliable PCB assembly.

Key advantages of BGA packaging include:

  • Reduced board thickness – ideal for smartphones, tablets, and compact electronics

  • Enhanced mechanical durability – no fragile pins to bend or break

  • Improved thermal and electrical performance – essential for high-speed systems

  • Minimal maintenance requirements

  • Excellent compatibility with high-efficiency system designs

ACME PCB: Decades of Experience in BGA Assembly

At ACME Printed Circuit Board Assembly, we’ve offered BGA assembly and rework services since 1994. With advanced X-ray inspection systems and IPC-compliant processes, we provide precision BGA assembly on boards up to 65mm² and up to 36 layers.

Whether you need a production run or BGA prototype assembly, we can accommodate your needs—with or without stencils—to help reduce prototyping costs and accelerate development.

We are an ISO 9001:2015-certified electronics contract manufacturer located in Southern California, near the Los Angeles airport, specializing in small to medium PCB assembly runs. Our team adheres to IPC 610 workmanship standards and is committed to delivering consistent quality and high-yield BGA assemblies.

Need high-performance BGA assembly backed by decades of experience?
📞 Contact us today at 310-715-1898 or email us for more information.