When it comes to electronic products, the materials you choose for your printed circuit board (PCB) can make all the difference in performance, reliability, and even cost. Selecting the right PCB material isn’t just about picking what’s readily available; it’s about matching the material’s properties to your specific application. At Board Assembly, we understand the importance of PCB material selection and are here to help you navigate the options. Why PCB Material Matters Your PCB

For many entrepreneurs and manufacturers, traditional methods of electronics and printed circuit board (PCB) manufacturing can seem intimidating. Legacy manufacturing is often slow, error-prone, and expensive, which makes it difficult to move from concept to finished product. Historically, electronic assembly was designed for large batch runs and long lead times, leaving smaller orders and prototypes in a bind. Today, however, turnkey PCB assembly has revolutionized the industry, making it faster, easier, and more cost-effective for

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them. There are two popular configurations for PoP assemblies: Pure Memory Stacking: multiple memory packages are stacked on each other Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package The packages are stacked on

There are many benefits of uBGA Assembly on Double Sided Flex Circuit Board offered by the Acme PCB Assembly, beginning with the fact it can considerably improve the physical characteristics of a design by reducing both weight and size. The cost and performance advantages of using uBGA Assembly on Double Sided Flex Circuit Boards are also quality points that engineers and designers keep in mind, since this technology is used in many types of industries.

A Ball Grid Array (BGA) is a type of Surface Mount Technology (SMT) packaging widely used for integrated circuits (ICs) that require a large number of interconnects. BGA packaging allows for a compact, high-density design, enabling the integration of more functions on a single chip module—making it an essential component in today’s modern electronics. What Makes BGA Technology So Effective? Instead of using pins like traditional packages, a BGA uses an array of solder balls