Tag Archives: BGA assembly

Processor with ball BGA pins

BGA Board Assembly, Rework and Modifications

BGA rework, replacement. Board Assembly uses the most powerful tools to maintain the state-of-the-art production. 

Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons.  Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues.  These irregularities can be resolved with BGA rework. We provide a comprehensive BGA rework and re-balling services to maintain the efficacy of SMT circuit boards.

8,000 W medium wavelength IR heater measuring 500 mm x 625 mm. The IR/PL 650 XL is Ersa‘s flagship machine for extra large printed circuit boards (PCBs). PCBs up to 20″ x 24″ or 500 mm x 625 mm can now be safely and rapidly reworked. 

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Board Assembly began offering Ball Grid Array (BGA) Assembly services in the early 90s. Over these many year’s experience BGA assembly with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA assembly board.

Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting. Our assembly capabilities include BGA assembly and rework up to 65mm squared up to 36 layer printed circuit board.

BGA (Ball Grid Array) board assembly, rework, and modifications are common processes in electronics manufacturing and repair. Here’s an overview of each process:

  1. BGA Board Assembly:
    • BGA assembly involves mounting BGA components onto a PCB (Printed Circuit Board). BGAs have solder balls beneath the component that are used to make connections to the PCB.
    • The assembly process typically involves solder paste deposition onto the PCB pads, placement of the BGA component onto the pads, and reflow soldering to melt the solder and create electrical connections.
    • Proper alignment, solder paste application, and reflow profiles are critical for successful BGA assembly.
  2. BGA Rework:
    • BGA rework is necessary when there are defects in the initial BGA assembly, such as insufficient solder, solder bridges, or misalignment.
    • Rework can involve the removal of the faulty BGA component using specialized equipment like a rework station or reflow oven. This process often requires careful heating to avoid damaging the PCB or surrounding components.
    • After removal, the site is cleaned, and fresh solder paste may be applied if necessary. Then, a new BGA component is placed and reflow soldered.
  3. BGA Modifications:
    • BGA modifications are changes made to the BGA components or PCB after the initial assembly process.
    • This can include upgrading components, changing the BGA footprint, or adding/removing features on the PCB.
    • Modifications may involve removing existing components, adding new ones, cutting traces, or making changes to the PCB layout.
    • Care must be taken to ensure that modifications do not adversely affect the functionality or reliability of the circuit.

Common tools and equipment used in BGA assembly, rework, and modifications include:

  • Reflow ovens: Used for melting solder paste to create electrical connections during initial assembly and rework.
  • Rework stations: Equipped with heating elements and hot air nozzles for precise heating during BGA removal and placement.
  • Soldering irons: Used for touch-up soldering and fine-detail work.
  • Flux: Used to aid in soldering and rework by improving wetting and preventing oxidation.
  • Solder paste dispensers: Used for applying solder paste to PCB pads before BGA placement.
  • Inspection equipment: Including magnifying glasses, microscopes, and X-ray machines for inspecting solder joints and connections.

BGA assembly, rework, and modifications require skill, experience, and attention to detail to ensure the reliability and functionality of electronic devices.

Contact Us for more information.

BGA inspection

Understanding BGA Assembly Technology

A Ball Grid Array or (BGA) is a SMT (Surface Mount Technology) package that is most commonly used for Integrated Circuits (ICs) with a large number of pins. Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module.

With it being a high-density and low-cost packaging option, this technology helps create the best range of circuit boards with precision component placement and soldering excellence.  BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting.  ACME PCB assembly has capabilities that include (ball grid array) BGA assembly and rework up to 65mm squared up to 36-layer printed circuit board.

BGA technology, which uses an array of solder balls for electrical interconnection, offers up several advantages over pin-grid array (PGA).  A couple important advantages of this surface-mount package is:

  • Ball Grid Array enables assemble boards with reduced thickness. This is beneficial when it comes to making sleek electronic products like smart phone, and tablets.
  • They seldom require maintenance and repair.
  • The packaging is more stable because there are no pins that can be bent and broken.
  • Excellent improvement in both thermal and electrical performance, which efficiently uses the space of the circuit board.
  • BGA packaging is compatible with high-efficiency system products.

ACME Printed Circuit Board Assembly started it’s (Ball Grid Array) BGA assembly service in 1994.  With so many years of experience in BGA assembly with X Ray inspection machine, and having the right assembly procedure in place, we are confident in saying that we can build a high quality, good yield rate BGA assembly board.

ACME Printed Circuit Board Assembly is an EMS located in Southern California near Los Angeles airport, it especially for Small to Medium run PCB assembly. Our workmanship meets IPC 610 standard. ISO 9001:2015 certified manufacturer for Electronics Contract manufacturing since Year 2000.

ACME PCB assembly also does BGA prototype assembly for our customers. We are able to create a BGA prototype assembly with or without stencil to help save our customer’s prototyping cost.

Please contact us 310-715-1898, or email us if you have any question.

 

Processor with ball BGA pins

Ball Grid Array (BGA) Assembly Inspections

ACME PCB Assembly has provided (Ball Grid Array) BGA assembly, BGA rework, and BGA reballing service for Printed Circuit Boards since 1994. Having 20+ years experience behind us, we have extensive knowledge on how to assemble high quality (Ball Grid Array) BGAs. We have experience with everything from Micro BGAs to large size BGAs (55 mm), and ceramic BGAs to plastic BGAs.

BGA-boardsBGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows for the customer to have more room for the PCB layout.  Ball Grid Array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting.

ACME PCB Assembly has a quality system for BGA assembly, the BGA will be received and inspected, and kept in a 40-degree Celsius storage with a 1% humility baking oven to make sure the BGA is good condition before assembly.  We inspect the BGA with a 3D X-ray, and make sure the void is under 25% of the total solder ball diameter. By using the X-Ray inspection process, we can eliminate the soldering problem on the board, such as solder bridging and insufficient ball melting.

We also add an additional layer inspection after the X-Ray inspection is done; using the ERSA scope to inspect the solder ball on the underside of the BGA so that we are sure the profile is correct; we assure you excellent quality during the BGA assembly process.  Some BGA assembly boards have VIA connect to the BGA pad, the best condition for that is have a VIA epoxy plug, and have the solder mask on the trace, so that solder is not wicked to the VIA and cause the solder to function insufficiently during the BGA assembly process.

By having ACME PCB Assembly do the BGA assembly prototype with or without Stencil will save you as the customer on assembly costs.

Please call us at 310-715-1898 for get more information or Assembly quotation.