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BGA inspection

Ball Grid Array (BGA) Assembly: High-Density SMT Solutions from ACME PCB

A Ball Grid Array (BGA) is a type of Surface Mount Technology (SMT) packaging widely used for integrated circuits (ICs) that require a large number of interconnects. BGA packaging allows for a compact, high-density design, enabling the integration of more functions on a single chip module—making it an essential component in today’s modern electronics.

What Makes BGA Technology So Effective?

BGAInstead of using pins like traditional packages, a BGA uses an array of solder balls on the underside of the component. These balls create electrical connections during reflow soldering, improving both thermal conductivity and electrical performance. The result is a more robust, space-efficient, and reliable PCB assembly.

Key advantages of BGA packaging include:

  • Reduced board thickness – ideal for smartphones, tablets, and compact electronics

  • Enhanced mechanical durability – no fragile pins to bend or break

  • Improved thermal and electrical performance – essential for high-speed systems

  • Minimal maintenance requirements

  • Excellent compatibility with high-efficiency system designs

ACME PCB: Decades of Experience in BGA Assembly

At ACME Printed Circuit Board Assembly, we’ve offered BGA assembly and rework services since 1994. With advanced X-ray inspection systems and IPC-compliant processes, we provide precision BGA assembly on boards up to 65mm² and up to 36 layers.

Whether you need a production run or BGA prototype assembly, we can accommodate your needs—with or without stencils—to help reduce prototyping costs and accelerate development.

We are an ISO 9001:2015-certified electronics contract manufacturer located in Southern California, near the Los Angeles airport, specializing in small to medium PCB assembly runs. Our team adheres to IPC 610 workmanship standards and is committed to delivering consistent quality and high-yield BGA assemblies.

Need high-performance BGA assembly backed by decades of experience?
📞 Contact us today at 310-715-1898 or email us for more information.

BGA inspection

How BGA Assembly Improves Performance in Modern Electronics

In the world of modern electronics, achieving optimal performance, reliability, and miniaturization is essential. Ball Grid Array (BGA) Assembly has emerged as a key technology in printed circuit board (PCB) manufacturing, enabling high-speed performance and superior durability. As industries continue to push for more compact and efficient devices, BGA Assembly plays a critical role in ensuring electronic components meet rigorous demands.

What Is BGA Assembly?

Processor with ball BGA pinsBGA (Ball Grid Array) is a surface-mount packaging technology that enhances electrical and thermal performance in PCBs. Unlike traditional dual in-line or quad flat packages, BGA uses an array of solder balls beneath the component rather than protruding pins. These solder balls establish electrical connections to the PCB, offering better heat dissipation, signal integrity, and mechanical stability.

Key Advantages of BGA Assembly

1. Higher Performance and Reliability

With shorter electrical pathways, BGA assembly improves signal transmission speeds and reduces interference. This design ensures lower inductance and resistance, making it ideal for high-frequency applications such as processors, graphics cards, and networking devices.

2. Better Heat Dissipation

Excessive heat is a major concern in compact electronic devices. The BGA package efficiently dissipates heat due to its larger contact area and direct connection to the PCB. This improved thermal performance extends the lifespan of components, reducing the risk of overheating failures.

3. Enhanced Miniaturization

Modern electronics demand smaller yet more powerful components. BGA Assembly allows for higher pin counts in a compact space, enabling manufacturers to fit more functionality into smaller devices. This is crucial in mobile phones, wearables, and high-performance computing systems.

4. Stronger Mechanical Connections

Unlike traditional leaded packages, BGA solder joints are less prone to mechanical stress and vibration-related failures. The spherical solder connections provide better adhesion, enhancing the overall durability of the PCB.

Applications of BGA Assembly in Modern Electronics

BGA technology is widely used across various industries, including:

  • Consumer Electronics – Smartphones, tablets, laptops, and gaming consoles rely on BGA packaging for their processors and memory chips.
  • Automotive Electronics – Advanced driver-assistance systems (ADAS) and infotainment systems benefit from BGA’s superior reliability in harsh conditions.
  • Medical Devices – Wearable health monitors and imaging equipment require compact and high-performance PCBs.
  • Telecommunications & Networking – Routers, 5G infrastructure, and high-speed networking equipment utilize BGA Assembly for improved signal integrity.

Ensuring Quality in BGA Assembly

BGA-boardsWhile BGA Assembly offers numerous benefits, ensuring flawless soldering and defect-free connections is crucial. Advanced techniques like X-ray inspection and reflow soldering help detect hidden defects and guarantee the highest level of precision.

At Board Assembly, we specialize in high-quality BGA Assembly with state-of-the-art manufacturing techniques. Whether you need custom PCB solutions, rework services, or advanced testing, our expert team ensures reliable and high-performance electronic assemblies.

As electronics continue to evolve, BGA Assembly remains a critical technology for improving performance, efficiency, and reliability. By offering better heat dissipation, superior signal integrity, and enhanced miniaturization, BGA technology is shaping the future of high-performance devices.

To learn more about our BGA Assembly services, visit Board Assembly’s BGA Assembly page and discover how we can optimize your electronic designs.

Processor with ball BGA pins

BGA Board Assembly, Rework and Modifications

BGA rework, replacement. Board Assembly uses the most powerful tools to maintain the state-of-the-art production. 

Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons.  Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues.  These irregularities can be resolved with BGA rework. We provide a comprehensive BGA rework and re-balling services to maintain the efficacy of SMT circuit boards.

8,000 W medium wavelength IR heater measuring 500 mm x 625 mm. The IR/PL 650 XL is Ersa‘s flagship machine for extra large printed circuit boards (PCBs). PCBs up to 20″ x 24″ or 500 mm x 625 mm can now be safely and rapidly reworked. 

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Board Assembly began offering Ball Grid Array (BGA) Assembly services in the early 90s. Over these many year’s experience BGA assembly with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA assembly board.

Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting. Our assembly capabilities include BGA assembly and rework up to 65mm squared up to 36 layer printed circuit board.

BGA (Ball Grid Array) board assembly, rework, and modifications are common processes in electronics manufacturing and repair. Here’s an overview of each process:

  1. BGA Board Assembly:
    • BGA assembly involves mounting BGA components onto a PCB (Printed Circuit Board). BGAs have solder balls beneath the component that are used to make connections to the PCB.
    • The assembly process typically involves solder paste deposition onto the PCB pads, placement of the BGA component onto the pads, and reflow soldering to melt the solder and create electrical connections.
    • Proper alignment, solder paste application, and reflow profiles are critical for successful BGA assembly.
  2. BGA Rework:
    • BGA rework is necessary when there are defects in the initial BGA assembly, such as insufficient solder, solder bridges, or misalignment.
    • Rework can involve the removal of the faulty BGA component using specialized equipment like a rework station or reflow oven. This process often requires careful heating to avoid damaging the PCB or surrounding components.
    • After removal, the site is cleaned, and fresh solder paste may be applied if necessary. Then, a new BGA component is placed and reflow soldered.
  3. BGA Modifications:
    • BGA modifications are changes made to the BGA components or PCB after the initial assembly process.
    • This can include upgrading components, changing the BGA footprint, or adding/removing features on the PCB.
    • Modifications may involve removing existing components, adding new ones, cutting traces, or making changes to the PCB layout.
    • Care must be taken to ensure that modifications do not adversely affect the functionality or reliability of the circuit.

Common tools and equipment used in BGA assembly, rework, and modifications include:

  • Reflow ovens: Used for melting solder paste to create electrical connections during initial assembly and rework.
  • Rework stations: Equipped with heating elements and hot air nozzles for precise heating during BGA removal and placement.
  • Soldering irons: Used for touch-up soldering and fine-detail work.
  • Flux: Used to aid in soldering and rework by improving wetting and preventing oxidation.
  • Solder paste dispensers: Used for applying solder paste to PCB pads before BGA placement.
  • Inspection equipment: Including magnifying glasses, microscopes, and X-ray machines for inspecting solder joints and connections.

BGA assembly, rework, and modifications require skill, experience, and attention to detail to ensure the reliability and functionality of electronic devices.

Contact Us for more information.

Processor with ball BGA pins

Ball Grid Array (BGA) Assembly Inspections

ACME PCB Assembly has provided (Ball Grid Array) BGA assembly, BGA rework, and BGA reballing service for Printed Circuit Boards since 1994. Having 20+ years experience behind us, we have extensive knowledge on how to assemble high quality (Ball Grid Array) BGAs. We have experience with everything from Micro BGAs to large size BGAs (55 mm), and ceramic BGAs to plastic BGAs.

BGA-boardsBGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows for the customer to have more room for the PCB layout.  Ball Grid Array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA (Ball Grid Array) also replaces solder balls on the component underside for SMT mounting.

ACME PCB Assembly has a quality system for BGA assembly, the BGA will be received and inspected, and kept in a 40-degree Celsius storage with a 1% humility baking oven to make sure the BGA is good condition before assembly.  We inspect the BGA with a 3D X-ray, and make sure the void is under 25% of the total solder ball diameter. By using the X-Ray inspection process, we can eliminate the soldering problem on the board, such as solder bridging and insufficient ball melting.

We also add an additional layer inspection after the X-Ray inspection is done; using the ERSA scope to inspect the solder ball on the underside of the BGA so that we are sure the profile is correct; we assure you excellent quality during the BGA assembly process.  Some BGA assembly boards have VIA connect to the BGA pad, the best condition for that is have a VIA epoxy plug, and have the solder mask on the trace, so that solder is not wicked to the VIA and cause the solder to function insufficiently during the BGA assembly process.

By having ACME PCB Assembly do the BGA assembly prototype with or without Stencil will save you as the customer on assembly costs.

Please call us at 310-715-1898 for get more information or Assembly quotation.