When it comes to printed circuit board (PCB) manufacturing, the terms “full turnkey” and “turn-key assembly” are often synonymous with efficiency, quality, and convenience. At Board Assembly, we offer comprehensive solutions that cater to every aspect of PCB production. Our full turnkey services are designed to streamline the entire process, from initial design and prototyping to final production and testing, ensuring that every product meets the highest standards of quality and reliability. What is

In the fast-paced world of electronics manufacturing, efficiency and precision are paramount. At Board Assembly, we understand the critical role that a seamless production process plays in bringing innovative products to market swiftly and reliably. That’s why we offer comprehensive full turnkey solutions designed to meet the diverse needs of our clients. These solutions not only streamline the production process but also ensure that every detail is meticulously handled, from initial design to final delivery.

BGA rework, replacement. Board Assembly uses the most powerful tools to maintain the state-of-the-art production.  Performance may suffer in mass produced Ball Grid Array (BGA) devices due to many different reasons.  Defects in the device, lack of or excess solder joints, or oversights during upgradation processes can be included as one of the may reasons for performance issues.  These irregularities can be resolved with BGA rework. We provide a comprehensive BGA rework and re-balling services

Why Consider Using Through Hole Printed Circuit Boards? In the printed circuit board business, there are two primary ways to mount components onto the circuit board: through-hole mounting and surface mounting. Through-hole mounting is the older technology and requires the circuit board manufacturer to drill holes through the PCB and place leads into the holes. More recently, surface mounted technology has taken over the field. Through-Hole Components Through-hole components come in one of two types

In the ever-evolving world of electronics manufacturing, choosing the right assembly method is crucial for optimizing both performance and cost-efficiency. Two prominent techniques in this realm are Surface Mount Technology (SMT) and Through-Hole Technology. Each has its own advantages and drawbacks, making it essential to understand their unique characteristics and applications. Surface Mount Technology (SMT) has become the industry standard due to its efficiency and versatility. SMT involves mounting electronic components directly onto the surface