For many entrepreneurs and manufacturers, traditional methods of electronics and printed circuit board (PCB) manufacturing can seem intimidating. Legacy manufacturing is often slow, error-prone, and expensive, which makes it difficult to move from concept to finished product. Historically, electronic assembly was designed for large batch runs and long lead times, leaving smaller orders and prototypes in a bind. Today, however, turnkey PCB assembly has revolutionized the industry, making it faster, easier, and more cost-effective for

Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them. There are two popular configurations for PoP assemblies: Pure Memory Stacking: multiple memory packages are stacked on each other Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package The packages are stacked on

There are many benefits of uBGA Assembly on Double Sided Flex Circuit Board offered by the Acme PCB Assembly, beginning with the fact it can considerably improve the physical characteristics of a design by reducing both weight and size. The cost and performance advantages of using uBGA Assembly on Double Sided Flex Circuit Boards are also quality points that engineers and designers keep in mind, since this technology is used in many types of industries.

A Ball Grid Array (BGA) is a type of Surface Mount Technology (SMT) packaging widely used for integrated circuits (ICs) that require a large number of interconnects. BGA packaging allows for a compact, high-density design, enabling the integration of more functions on a single chip module—making it an essential component in today’s modern electronics. What Makes BGA Technology So Effective? Instead of using pins like traditional packages, a BGA uses an array of solder balls

Electronic Contract Manufacturing Service Acme Printed Circuit Board Assembly (PCB Assembly service provider) is located in Carson, California. We have a 16,000 square foot facility with the best equipment (Fuji assembly line) that allows us to offer high-quality PCB assembly at competitive prices. Our ISO 9000 (9001:2015) certification is a source of pride for us.  It indicates that we provide measurable high-quality electronic contract manufacturing services that meet or exceed customer expectations. Whether you need Printed Circuit Board (PCB)