Package-on-Package (PoP) is a type of IC packaging method that combines ball grid array (BGA) packages. In this method, two or more packages are vertically installed (i.e. stacked) with an interface that can direct signals between them. There are two popular configurations for PoP assemblies: Pure Memory Stacking: multiple memory packages are stacked on each other Mixed Logic-Memory Stacking: a memory package is stacked on top of a CPU package The packages are stacked on

There are many benefits of uBGA Assembly on Double Sided Flex Circuit Board offered by the Acme PCB Assembly, beginning with the fact it can considerably improve the physical characteristics of a design by reducing both weight and size. The cost and performance advantages of using uBGA Assembly on Double Sided Flex Circuit Boards are also quality points that engineers and designers keep in mind, since this technology is used in many types of industries.

A Ball Grid Array or (BGA) is a SMT (Surface Mount Technology) package that is most commonly used for Integrated Circuits (ICs) with a large number of pins. Ball grid array packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. With it being a high-density and low-cost packaging option, this technology helps create the best range of circuit boards with precision component placement and soldering

ACME PCB assembly is working to meet the growing demand for tabletop “box builds” we have a dedicated team for each department, including covering the purchasing, electronics engineering, contract manufacturing services, and testing.  Our team will support all your electro-mechanical projects from the initial stages of design conception and prototyping through volume production. ACME PCB assembly provides cost-effective turnkey manufacturing solutions to meet your specific project requirements and timeline. This results in a full turnkey solution to meet your business’s

Electronic Contract Manufacturing Service Acme Printed Circuit Board Assembly (PCB Assembly service provider) is located in Carson, California. We have a 16,000 square foot facility with the best equipment (Fuji assembly line) that allows us to offer high-quality PCB assembly at competitive prices. Our ISO 9000 (9001:2015) certification is a source of pride for us.  It indicates that we provide measurable high-quality electronic contract manufacturing services that meet or exceed customer expectations. Whether you need Printed Circuit Board (PCB)